Lead Free Rework
Successful rework and assembly methods have been developed with lead-free solders for all types of components. During the transition period to lead-free manufacturing rework practices have to be developed that deal with the issues related to handling, reworking, tracking and inspecting lead free PCB assemblies.
Lead Free Repair

 XRAY Inspection
XRAY imaging is a widely utilized analytical tool for the SMT PCB manufacturing process. In PCB assembly area array packages such as CGA, BGAs and CSPs with their concealed solder joints, have become the main field of application for X-ray inspection.
XRAY Inspection

IR Rework
Infrared rework systems offer several advantages to the rework process. Due to the computer controlled heat and time sources the profiles stored in the rework system are highly repeatable and more precisely controlled compared to their hot air counterparts.
IR Rework.

Visual Inspection
A strong supplemental tool to XRAY, a boroscopic inspection tool, allows hidden solder joint or joints that are in close proximity to other nearby parts to be inspected and characterized. BEST has the capability to inspect and troubleshoot process defects through the use of this tool.
Visual Inspection

Soldering Tip Videos
BEST IPC Master Instructors have put together hands-on demo videos for common soldering practices.
Soldering Tip Videos

BGA Rework Process
The following describes the general BGA rework process covering the development and criteria for establishing profiles for BGA removal and replacement.
BGA Rework Process