in this issue Lead-Free Solder Ball Detachment/Sn63 Ball Attachment New Circuit Frame for BGA Pad Replacement BEST to Speak at Lead Free Technical Symposium "Complying with RoHS" Symposium

In this issue we bring you information on the BGA reballing process, introduce you to a new BGA repair circuit frame as well inform you of two opportunities to learn about the issues electronics assemblers are facing in the conversion to a lead- free soldering process. BEST instructors and staff will be on-hand speaking at two Midwest-based events where your knowledge base of the conversion process can be greatly expanded while getting a chance to "network" with your peers. We look forward to seeing you at either event soon.

	Lead-Free Solder Ball Detachment/Sn63 Ball Attachment

BEST and Re-Balling BGAs.  As the changeover to lead-free solder alloys moves forward contract manufacturers and OEMs have begun receiving BGAs with lead-free solder balls. It most cases the conversion from the Sn63 to lead-free process has not yet occurred, leaving the users with little choice but to have the device reballed with tin- lead solder balls. There are several controlled methods by which BEST can reball an area array device. These can be found on the extensive process description listed below.

To find out more about reballing techniques
 

	New Circuit Frame for BGA Pad Replacement

In line with its other circuit board repair products, BEST has developed a BGA circuit frame (P/N BEST5CktTrack) for the replacement of a variety of BGA land patterns. This circuit frame allows you to choose from a wide variety of pad sizes with different orientation of traces into and out of the pads. These circuit frames feature tin coating for compatibility with both Sn63 and lead-free solders. Call us today if you would like to have a custom frame designed for your application.

Find out more about other repair tools
 

	BEST to Speak at Lead Free Technical Symposium

Mark your calendars for Friday June 3rd as the local SMTA chapter will be hosting a lead-free soldering technology symposium. This symposium will feature a variety of topics such as: "How to eliminate voids in lead-free solder processing", "The latest in IPC inspection criteria for lead free solder joints" and "Lead-free solder reflow oven profiling". Ray Cirimele from BEST will be speaking on lead-free rework and BGA issues.

To find out how to register for this event....
 

	"Complying with RoHS" Symposium

If you are in the midst of trying to figure out the variety of RoHS compliance, reporting and tracking issues then the SMTA-sponsored "Complying with RoHS" symposium may be for you. It will focus on experiences that companies are having in solving the many difficult compliance challenges. The format for this workshop is designed to be highly interactive. This event will be held June 21st at Guidant Corporation in St. Paul, MN. BEST will be presenting information on "Converting to Pb-free Manufacturing". Conversion issues such as the effect of higher reflow temperatures, dealing with increased MSD levels and wave solder bath conversion strategies will be discussed. Attendees will learn tactics for reducing their conversion times and problems, while accelerating their overall conversion efficiency.

Find out how to register here....

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